Specifications
The Dimensity 9200+ chipset includes one ultra-core Arm Cortex-X3 operating at up to 3.35GHz, three Arm Cortex-A715 super-cores operating at up to 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz. It supports faster clock speeds than its predecessor, the Dimensity 9200 chipset. MediaTek upped the Dimensity 9200+’s Arm Immortalis-G715 GPU by 17% to give it an extra boost for gaming and other computationally demanding tasks.
Features
A 4CC-CA 5G Release-16 modem in the Dimensity 9200+ seamlessly changes between long-range sub-6GHz and lightning-fast mmWave connections. Along with Bluetooth 5.3, the chipset also supports Wi-Fi 7 2×2 + 2×2 with a maximum transfer throughput of 6.5Gbps. With incredibly low latency and without interference, Wi-Fi, Bluetooth low energy (LE) audio, and wireless peripherals may all connect simultaneously thanks to MediaTek’s coexistence technology. The MediaTek Dimensity 9200+ also has the following notable features: HyperEngine 6.0: Adaptive performance technology that can support high framerates and low latency further enhancing the gaming experience. The process from TSMC’s second generation, 4 nm-class: Perfect for ultra-slim designs in a range of form sizes.
Advantages
The Mediatek Dimensity 9200+ easily handles AI noise reduction and AI super-resolution duties, and by adjusting focus and Bokeh in real-time, it produces cinematic footage. The powerful flagship image signal processor, the MediaTek Imagiq 890, offers to engage in capturing and produces clear, brilliant photos and videos even in low-light conditions. The display technology of the MediaTek MiraVision 890 with motion blur reduction and adjustable refresh rate, the chipset adds a fluid user experience. With the MediaTek 5G UltraSave 3.0, battery life optimisation technology for all 5G connectivity scenarios can also be optimised.
Availability
Starting from May 2023, MediaTek Dimensity 9200+-equipped smartphones are anticipated to be available.